Job Description

We are seeking an experienced PCB Design Engineer to support the design and development of mission-critical electronic products for aerospace, defence, military and airborne applications. The role focuses on complete PCB design lifecycle activities including schematic support, component placement, routing, stack-up definition, manufacturing coordination, documentation and design verification.

Key Responsibilities

• Design experience in PCBs up to 10 Layers and more
• Maintaining the Symbol Library and creating new symbols
• Schematic Entry with the assistance of Design Team
• Component Placement, Routing, Design of Stack up, Routing, Gerber Generation
• Coordinating with Mechatronics for deciding position and orientation of connectors, suitable cut outs for proper fitment in the enclosure, location and dimension of mounting holes and providing adequate margin.
• Coordination with design teams for verification and clearance of placement, routing, layers and stack up.
• Generating Bill of Material (automatic), and other documents and inputs required for PCB assembly by Production.
• Generating various documents required by the Design Team as in the format prescribed by the certifying agency.
• Coordination with PCB manufacturing agencies and clearing the queries and DFM issues.
• Coordination with design analysis (like thermal analysis and signal integrity analysis) agencies and providing them with necessary data.
• Ensuring portability of symbols and PCB design to OrCAD.
• Documentation and Report Generation as per AS9100D.
• Guiding, managing, work allocation and supervising the team members.

Skill & Experience

• Hands-on experience with Cadence OrCAD or Zuken CADSTAR is desirable and will be an added advantage.
• Experience of complete PCB design life cycle in designing Analog, Digital and Mixed Signal boards for mission critical applications for military and airborne applications.
• Experience with High Speed Digital design (like processors, DDR4 memory), differential interfaces (like PCI Express, LVDS)
• Experience of Mixed Signal designs and High Density designs (like Ultra Fine Pitch BGAs, QFN & DFN packages, 0402, 0201 size discretes)
• Experience in RF and Power Circuits is desirable.
• Familiarity with PCB manufacturing technology and standards, various types of laminates (flexi, rigid, flexi-rigid), various types of PCBs (like commercial, MIL Grade)
• Familiarity with thermal design aspects, techniques for EMI/EMC compliance.
• Good and working knowledge of IPC standards.

 

Experience:

• Having in depth work experience in PCB Design for 1-4 years
• Service agreement for 2 years (for 1-2 yrs. Experienced)